現在對材料微小化的需求已逐漸被應用到高科技產業上，然而材料於微小尺度上其內部結構與塊材相比有著極大的不同，因此若以塊材之觀點來描述小尺度下的機械行為是不適宜的。一般材料因受到晶粒、純度和表面體積比的影響，使得其機械性質在塊材與薄膜的微小尺度下有顯著的差異，所以對薄膜材料在次微米－奈米尺度下機械性質的認知就成為極重要的研究。本文介紹目前設計發展之一些可單次及多次循環負載於試件並同步量測其應變反應之非破壞性量測方法，分析應用於各種微系統產業中的薄膜材料在次微米－奈米尺度下的機械性質。期望藉由對薄膜材料機械性質的了解，提供材料元件在製程及使用可靠度的預測分析。

As the feature of materials in the scale of sub-micrometer to nanometers, the mechanical properties of nanostructure materials are different from their bulk structures. The understanding of relationship between nanostructure and mechanical properties is a common challenge to semiconductor, MEMS and nanotechnologies. This article presents one of the direct non- destructive and less ambiguous experimental uniaxial stress testing techniques for the mechanical characterization of freestanding thin films using specimens with dimensions as few hundred nanometers. This testing approach was proved to yield the direct experimental mechanical property values. These data can then be used to construct an accurate stress models for the mechanical behavior of thin film materials use for semiconductor, MEMS and nanotechnologies.