網際網路的興起，讓行動化、寬頻與資訊擷取，成為二十一世紀的風潮。易使用、隨時隨地
皆可使用之整合系統，係成為下一世代的產品趨勢，而支援這些系統所需要的系統整合晶片技術
遂成為最重要的基礎技術。台灣相當欠缺從系統到晶片的整合設計能力，目前這些重要之關鍵晶
片系統的設計技術，皆掌握在歐美國家，台灣唯在此產業佔有一席之地，方能提昇產業之高附加
價值。本計畫以「矽晶圓製造為根，晶片系統設計為幹，創造優質生活為果」的基本精神推動，
藉由本計畫執行，加速台灣由應用晶片 (ASIC)、系統封裝 (SiP)轉型到晶片系統(SoC)，掌握與開發 SoC核心技術，建立國際一流研發環境，協助台灣成為世界級 SoC設計/服務中心，延續半導體 /通訊/光電等產業實力，以因應全球化競爭。

The great advance in internet technologies make the mobilized and broadband information access become a tide in the 21st century. Integrated devices/systems with easy-to-use and mobile features are the
tendency of next generation products, implying that techniques for carrying out these systems play the most important role in SoC (System-on-Chip) applications. Nowadays, these fundamental SoC design techniques
are mastered by the countries of Europe and the United States; Taiwan is relatively poor in these areas. To add a higher value to our industries, Taiwan needs to take a place of its own, particularly in raising the
capability of dealing with SoC design. This project takes silicon wafer manufacturing as its root, SoC design as its trunk, and creating a better life as its fruit. The study of this project helps Taiwan accelerate the
industry transition from ASIC (Application-Specific Integrated Circuit) and SiP (System in Package) to SoC design. The core SoC techniques explored and developed in this project will facilitate building up a significant R&D environment and hence push Taiwan to become a world-class SoC design/service center that will extend our strength in semiconductor/communication/optoelectronics industries to meet global competition.