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| 篇名 | LED固態照明技術的分析與挑戰 |
|---|---|
| 卷期 | 31:2=172 |
| 並列篇名 | Technical Challenge of LED Solid State Lighting |
| 作者 | 孫慶成 |
| 頁次 | 90-94 |
| 出刊日期 | 200910 |
中文摘要
在本文中，筆者介紹LED固態照明技術的發展趨勢與可能遇到的瓶頸。在晶片的發展上，內部量子效率在高電流注入的環境下如何能維持高檔，將是材料科技人員的一大挑戰；在封裝上，光電色加上熱管理，全需以封裝後的成品來評價，而且攸關LED的照明表現；在光學技術上，我們探討了四階光學設計的概念與其在晶片、封裝、模組以至於燈具上的重要性，同時也探討人因科技在LED固態照明的角色。
英文摘要
In this paper, we discuss the development trend and the possible bottleneck of LED solid-state lighting. In the LED chip level, how to maintain the internal quantum efficiency under high current injection is a big challenge for the material engineering. In the package level, the quality in optical, color, electrical and thermal managements are related to the performance in LED lighting. In the optical technique, we introduce the concept of four-level optical design and discuss its role in chip, package, module and fixture levels, respectively. Besides, we also discuss the importance of human factor engineering to the LED lighting.