本研究屬於探索性研究，主要目的在探討高科技產業半導體工程師的生涯人際能力與生涯成功之間的關係。參考社會資本理論分類架構，本研究將生涯人際能力區分為有助於鞏固聚合式社會資本及有助於拓展橋接式社會資本兩大類型，以多個階層迴歸分析探究此兩大類型生涯人際能力對於工程師任務績效、脈絡績效和生涯滿足之影響。研究結果發現，如原先預期，解釋脈絡績效的主要生涯人際能力為和聚合式社會資本有關的生涯人際能力，此外，其他研究假設僅得到部分支持。本研究根據研究結果提出未来研究方向，並建議適度考量工作脈絡和工作所需的人際特性以設計友善人力資源管理措施。

With a rocus on the interpersonal dimension of careers, the present study aimed at exploring the relationships between engineers' interpersonal competencies for career and career success. Using a framework drawn from social capital theories (bonding versus bridging social capital), we carried out hierarchical regression analyses to examine the hypotheses linking the interpersonal competencies for career with three career-related outcomes (i.e. task performance, contextual performance, and career satisfaction). The results showed that only the hypothesis regarding the relationship between bonding social capital and contextual performance was supported. The others were partially supported. Based on the results, recommendations for future studies and human resource management were given at the end of this paper.