功率器件在經過迴流焊接工序後，往往因為錫在界面分布不均而產生孔洞，導致機械強度的減弱，造成導線架與半導體脫離的狀況。為了降低焊接後的錫孔隙率，本研究運用田口實驗法，以L9直角表設計實驗，考慮料片在迴焊爐中各溫區的停留時間(鏈速)、溫度和料片的翹曲效應，找出焊接之最佳參數組合。經過三次的田口實驗，錫平均孔隙率顯著的減少，分別為10.46%、2.11%和0.82%，有極佳的結果。實驗次數減少67%。

After the power device undergoes the reflow soldering process, holes are often generated due to the uneven distribution of tin at the interface, which results in a decrease in mechanical strength and a situation where the lead frame is separated from the semiconductor. In order to reduce the tin porosity after soldering, this research uses the Taguchi experiment method to design an experiment with an L9 right-angle table and consider the residence time (chain speed), temperature, and warpage effects of the blank in each temperature zone in the reflow furnace to find the best combination of parameters for welding. After three Taguchi experiments, the average tin porosity is significantly decreased, being 10.46%, 2.11%, and 0.82%, indicating an excellent result. The number of experiments reduces 67%.