擁有尺寸小、電性佳等優勢的覆晶封裝技術，在追求輕薄短小與高頻高速的微電子產業中，正逐漸成為構裝製程的主流。在覆晶技術蓬勃發展的同時，相關的可靠度問題亦引起廣泛的研究與探討。相關的可靠度問題亦引起廣泛的研究與探討。本文主要針對覆晶銲點中，金層與鎳層對界面反應的影響，收集文獻中相關的資料並整理提出報告。金/鎳墊層對覆晶銲點界面反應的影響，主要可以區分為幾個階段來討論，包括：(1)回銲過程中金層與鎳層的溶解對於銲料組成與界面結構改變的影響，(2)回銲過程中金層、鎳層與銲料之間固/液界面反應的情形，(3)熱處理過程中金層、鎳層與銲料之間固/固界面反應的情形。從文獻中所得到的結果，可以發現上述三個階段在銲點界面反應的研究中，其重要性皆不容忽視。此外，銲料的選擇，亦即是銲料的組成，對銲點界面反應同樣會造成影響。關於以上可能造成影響之因素與結果，本文將提供文獻中所收集到的相關資料作為參考。

　　　　　With the advantages of small size and excellent electrical performance, flip chip technology has gradually proved to be the main stream in the microelectronic packaging process. The vigorous development of flip chip packaging attracts extensive discussions on its relevant reliability problems. For the effects of the Au/Ni layers on the interfacial reactions of the flip chip solder joints, related literature were collected and reviewed in this article. The effects of the Au/Ni layers on the interfacial reactions of the flip chip solder joints were found to be significant. This article reviewed related literature and the effects were discussed from three main stages: firstly, the dissolution of the Au/Ni layers in the reflow process, secondly, the liquid/solid interfacial reactions between molten solders and Au/Ni layers in the reflow process, and thirdly, the solid/solid interfacial reactions between solders and Au/Ni layers in the heat treatment process.