歐盟於2002 年10 月通過RoHS 指令，2006 年07 月01 日起電子產品全面禁用含“鉛”物質。為確保產業競爭力，業者必須謹慎規劃其製程與選擇合適的物料，以提昇產品良率與可靠度。相關研究指出約莫60%焊接缺點源自於不當錫膏印刷製程控制，本研究運用田口方法針對錫銀銅305 銲料進行鋼板印刷實驗。並透過適合度檢定實驗數據是否呈常態分佈。運用信號雜音比與變異數分析，決定影響製程良率之顯著因子。再以驗証實驗判斷最佳製程參數水準組合之再現性。此外，應用反應曲面分析，瞭解各製程參數對印錫厚度的影響，作為日後製程參數調整之參考依據。最後提供，無鉛產品於鋼板印刷製程之最佳參數水準組合。

The soldering materials used in the electronics industry are mainly for the assembly of components onto the substrates and/or Printed Circuit Boards (PCBs).The eutectic tin lead solder (63Sn/37Pb)is commonly used due to its low cost and superior material properties. However, due to the harmful influence of lead to human health, the European Union has regulations to restrain the use of lead material by July 2006. This has resulted in a major impact on the electronics industry in Taiwan. Taguchi based experimental design is used to determine the optimal process parameters for the suggested material during stencil printing. The Kolmogorov-Smirnov test in used to determine if data collected follows the normal distribution. Signal to noise ratio and Analysis of Variance (ANOVA) are also conducted to explore the influence of several factors on the amount of solder paste deposited. The reproducibility of data from the combination of optimal process parameters is verified by the confirmation test. Finally, through the response surface method, the influence of engineering change can be determined.