本研究收集與分析自 1995 年至 2007 年台灣半導體相關產業重大災害事件。共收集了 59個災害案例。探討半導體產業上、下游較具高風險性的工廠與導致災害發生的重大原因。比較產生災害的製程或化學品，以確認何者易導致較重大災害或較大的經濟損失。災害的種類可分為四大類型，各為火災、爆炸、爆炸引起火災及有毒或有害化學品外洩。統計分析結果以半導體製業、PCB 製造業及電子組裝業較容易產生重大災害。發生災害事故以 2000 年及 2006 年次數較多，而一年中較容易發生事故在電子業旺季的 5 月份至 12 月份。發生災害的次數以火災所佔比率最高約 59%。59件災害事故總死亡人數為 11 人，總受傷人數為 183 人，設備及直接財物損失約 210 億元新台幣。

Reactive chemicals and combustible materials have led to numerous losses in semiconductor industry in Taiwan. Fifty nine incidents were collected and analyzed on related information to provide the integrated overviews of such events in the past thirteen years. Various types of factories either in the upstream or downstream of semiconductor industry were reviewed to deduce which kind of plant is feasible to possesses the higher risk of occurrence. Different kinds of chemicals or processes were compared with each other to verify the causes which led to the higher or largest loss already happened. Accidental fires caused by silane or flammable vapors are the dominant types of incidents in the semiconductor plant in comparison to any other types of materials. Besides, explosions, release of hazardous chemicals, and injuries by hazardous or corrosive chemicals are the three kinds of most common incidents encountered. Fire spread from the common exhaust duct or relief header always resulted in the largest loss among the reported events. The most serious lesson learnt from these losses was about three hundred million US dollars.