Sn-9Zn-(0~4)Ag迴銲於Cu/Ni/Au基板上，完全浸泡於去純水中做為陰陽兩極，兩極問施以3V~5V直流偏壓，研究其電化學遷移現象。結果顯示：此銲料系統中銀含量由0增高至4wt%時，其抗電化學遷移能力下降。兩銲球間之電化學遷移後之析出物經X-光光電子光譜儀(X-ray photoelectron spectrometer, XPS)分析結果顯示：其主要成分為ZnO、Zn、SnO、Sn，其中所含的鋅∕錫比值會隨遷移時間增加而比而減少；由能量散佈光譜(Energy Dispersive Spectrometer, EDS)分析顯示：在遷移1800秒、3600秒後兩極間樹狀析出物的錫含量亦隨時問增加而增加。電化學動態極化法(potentiodynamic polarization)在Sn、Zn、Ag等單一金屬、AgZn?介金屬及Sn-9Zn-(0~4)Ag三元銲料系統的探討有助於電化學遷移機理之解析。

The resistance of electrochemical migration of Sn-9Zn-(0~4)Ag solders, having been reflowed on Cu/Ni/Au, in water at 3~5V DC was found to decrease with increasing their silver content from 0 to 4 wt%. Analysis of XPS and EDX on the dendritc precipitate formed between two electrodes displays that the main components of the precipitate are ZnO, Zn, SnO, Sn. The ratio of Zn/Sn in the precipitate increases with the elapse of migration time. EDS analysis shows that the concentration of tin in the dendrite increases with increasing migration time from 1 800s to 3600s. Exploration in anodic potentiodynamic polarization curves for Sn, Zn, Ag, AgZn? and Sn-3Ag-XCu(X=0.0~0.9) benefits discussion of the electrochemical migration mechanism for the Sn-9Zn-(0~4)Ag soldering systems.