本研究藉助ANSYS分析軟體探討高亮度LED應用於汽車頭燈上的熱傳特性，並以晶片接面溫度的變
化，探討 LED 的熱傳導效益，使晶片維持在固定的操作溫度下，以維持元件的可靠度。探討之參數包含LED 排列形式與 Heat sink 的面積與厚度等。結果顯示，均勻分佈型與環型這兩種不同的排列形式，並沒有較明顯的溫度差異，改變Heat sink 的面積與厚度時，加大與加厚的Heat sink，在對流係數小於50W/m2‧K時，有較明顯的溫度差異，但此趨勢在對流係數超過 50W/m2 ‧K 之後，不同面積及厚度的 Heat sink 對於溫度的影響就變的很小。

In this paper, the ANSYS finite element software is used to study of the thermal characteristics of an automobile headlamp using high brightness LEDs as its light source. The parameters investigated include two LED layouts ring and distributed types, LED heat sink as its light source area and thickness and different connection conditions. The simulation results show that different layouts exhibit the same temperature distributions. Similarly, the heat sink areas and thickness effect are significant only when the convective coefficient is less than 50W/m2‧K. At larger convective coefficients, the heat sink area and thickness effect are insignificant, irrespective of LED layouts.