表面形貌量測在半導體及光學元件製造上是一項重要的技術。光學干涉量測以非接觸、全場性、速度快與高精密等優勢，大量應用於高科技產品表面形貌的量測。然而運用相位移技術時，由於相移機構的移動，取像時間較長，受到環境振動或空氣擾動的影響，容易產生較大誤差，亦不適用於生產線上的檢測。本文中簡介一套可以瞬時 (或同步) 擷取不同相位移干涉條紋圖像之量測系統。此系統利用偏光相位移干涉原理，透過一四影像合併鏡組，運用單一 CCD 同時擷取不同相移之干涉條紋，經由灰階校正及數位對正各影像之位置，可由相位移法以及相位展開求得相位值，轉換得到待測物的表面形貌。此系統經以平面鏡及晶圓進行實測，以驗證及探討此量測系統之準確性、誤差與穩定性。此系統之研發可以減除外在環境振動與量測時間過長所造成的影響，亟具實際運用的價值。

Surface profile measurement is an important technique in thesemiconductor industry and the manufacturing of the optical components. Due to its noncontact nature, full-field, high accuracy and resolution, phase-shifting interferometry (PSI) has been quite evolved in surface profile measurement of high-tech products. However,movement of the phase shifter, the vibration and air disturbance, and longer image-grabbing time make the PSI measurement inaccurate, and not suitable for on-line measurement. In this context, a measurement system that is capable to grab the phase-shifted interferometric images instantaneously (or simultaneously) for surface profile measurement is introduced. Using the polarization phase-shifting interferometry principles and through a four-image combining device, the system allows the four phase-shifted images to be grabbed by one CCD simultaneously.Then the grey-level values of the four images can be adjusted, digitally aligned to calculate the phase. The surface
profile is obtained after phase unwrapping. Test of the system on a flat mirror and a silicon wafer demonstrates its usefulness. The accuracy and stability of the measurement is discussed. The development of such system will reduce the effect due to environmental vibration, and thusapplicable for practical use.