篇名 | 含銅氮化鈦抗菌鍍膜用於衛浴黃銅的保固性 |
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卷期 | 25:1 |
並列篇名 | Copper-containing TiN Coatings on Sanitary Ware Copper Alloys for Protection Purpose |
作者 | 陳南仁 、 鍾啟仁 、 江忠鍵 、 陳克昌 、 何主亮 |
頁次 | 047-054 |
關鍵字 | 電弧離子鍍 、 磁控濺鍍 、 含銅氮化鈦 、 抗菌鍍膜 、 保固性 、 Arc ion planting 、 AIP 、 Magnetron sputtering 、 MS 、 Copper-containing titanium nitride 、 Antimicrobial coating 、 Protection performance 、 EI |
出刊日期 | 201103 |
目前沐浴器材上常用材料多以黃銅或鋅合金為底材,並施以耐蝕的電鍍鎳/鉻,唯外觀顏色單調。為求沐浴器材外觀顏色之多樣化及防刮耐磨之強化,本研究擬結合電弧離子鍍及磁控濺鍍法於同一艙體,以電弧靶座來發射金屬鈦,以濺鍍靶座來發射銅金屬,於預電鍍鎳/鉻之銅基材表面被覆兼具色彩及抗菌之含銅氮化鈦陶瓷鍍層,進一步對其保固性做探討。研究結果顯示;相較於預電鍍鎳/鉻之黃銅基材,鍍膜表面硬度、耐磨性和耐蝕性皆高於預電鍍鎳/鉻之黃銅基材。隨著鍍膜中銅含量由0 at%增加至21.65 at%,鍍膜表面硬度及耐磨耗性略為下降,唯腐蝕電位從–371.76 mV 提高到–201.62 mV(vs. Ag/AgCl),腐蝕電流密度則從0.612 μA/cm2 下降至0.489 μA/cm2。
Copper-zinc alloys, widely used for sanitary ware, were commonly pre-electroplated with corrosion resistant nickel/chromium, resulting in monotonic appearances. An arc ion plating (AIP)technique (for titanium emission) in combination with a magnetron sputtering (MS) source (for
copper emission) was employed in a single chamber to develop a color-controllable coppercontaining TiN antimicrobial coating in this study. Surface hardness, wear resistance and corrosion resistance were revealed as well. Experimental results showed that the copper-containing (Cu: 0 to
21.65 at%) titanium nitride coating distinctly gave rise to improved surface hardness, wear resistance and corrosion resistance of the alloy, comparing with the pre-electroplated Cu-35Zn substrate. Surface hardness and wear resistance slightly decreased at a higher copper content
though the alloy exhibited an increased corrosion potential (–371.76 mV to –201.62 mV vs.Ag/AgCl) and a decreased corrosion current density (0.612 μA/cm2 to 0.489 μA/cm2) in a sodium chloride solution.