本研究以電鍍鎳為結構層，鎳磷合金為表面層組織製備微機電系統結構，此電鍍鎳/鎳磷合金鍍層結合可同時具有高強韌、耐衝擊、耐腐蝕磨耗之電鑄結構體，並可調控鍍層總內應力。鎳磷合金鍍層以脈衝電鍍技術製備，磷含量14.3 wt% 為非晶質結構組織；電鍍鎳鍍層為粗大柱狀晶結構，且柱狀結構中觀察到雙晶與差排的結晶缺陷。經奈米壓痕試驗，鎳磷合金比電鍍鎳楊氏係數低，顯示電鍍鎳結構耐衝擊，鎳磷合金容許變形量低且硬度高，經由在5% NaCl 溶液之腐蝕磨耗試驗，驗證鎳磷合金皆比電鍍鎳有較優耐腐蝕與磨耗能力。

This study proposes a bi-layered Ni/Ni-P electrodeposited coating for application in microelectrochemical systems (MEMS). The Ni layer, which possesses high levels of stiffness and toughness, was used as the structural constituent, whereas the Ni-P layer, which demonstrates high
levels of hardness and corrosion resistance, served as the surface coating. Therefore, the combined coating demonstrated superior mechanical properties and tunable internal stress capabilities. The Ni-P layer was prepared with pulse plating and consisted of amorphous phase with 14.3wt% P. The DC-plated Ni layer consisted of columnar grains embedded with both twin and dislocation defects. The results of nano-indentation demonstrated that the Ni layer had higher Young’s modulus and the Ni-P layer had higher levels of hardness. Finally, the tribocorrosion test in 5% NaCl solution confirmed that the Ni-P layer had superior corrosion and wear resistance to its Ni counterpart.