自上世紀60年代發展以來，原子層沉積技術（atomic layer deposition, ALD)逐漸受到重視，尤其半導體製 程微縮化需求促進ALD設備工業化以及本世紀初ALD設備產業蓬勃發展，由於ALD技術具由極佳沉積 覆蓋性與厚度控制，許多現有半導體製程亦將轉換為ALD，因此在可見未來ALD製程技術與設備將在半 導體領域具有重要角色。正當ALD在半導體產業方興未艾，能源、民生、觸媒與光電產業亦觀察到ALD 應用可行性，因此ALD設備庭商根據產業製程需求，開發plasma-enhanced ALD、batch ALD、spatial ALD、roll-to-roll ALD與powder ALD等系統，並且達到工業量產之要求，顯示ALD設備仍有極大開發空間。

Since the invention in 1960s, atomic layer deposition (ALD) has been attracted great attention. The miniaturization of semiconductor devices is another trigger of equipment development and commercialization of ALD by the end of last century. ALD is also considered as an enabling technique to replace conventional coating tool due to the requirements of coating conformity and thickness control in next generation devices. Therefore, ALD technique and equipment will play greater role in the semiconductor industry. On the contrary, ALD shows potential in nonsemiconductor industries, such as energy, optoelectronics and catalysis. Innovative ALD systems, such as plasma-enhanced ALD、batch ALD、spatial ALD、roll-to-roll ALD, powder ALD, were developed by the equipment suppliers on the basis of the industrial needs. The throughputs of ALD systems can match the requirement for industrial commercialization.