顯示器四邊黏貼的IC ，利用直角座標機器人從事外引腳黏合作業。本研究進行機器人的振動分析，目的在探討設備運轉壓頭 於加壓 的黏合過程中 ，所產 生的振動影響。首先，我們使用工程繪圖軟體 SolidWorks，建造出模型。再匯入有限元素法軟體 ANSYS，進行網格化與設定並確認模型的正確性。先執行模態分析，獲得前四十個模態形狀，然後進行暫態分析。最後根據分析結果的動態特性，得到結構弱點與最大振幅位置， 得以提出適當的適當改善方法。

Display edges have to be stuck with ICs, and thus Cartesian coordinate robots are used to undergo outer lead bonding. In this study, robotic vibration analysis was conducted to meet the goal investigate vibration produced during bonding process. First, we constructed models of gantry, bonders, and base structure, then the models were imported into ANSYS sofeware to set the mesh and analysis conditions as well as to reconfirm the precisions of models. Forty modes were obtained in modal analysis employed in transient anemployed by the mode superposition method. Consequently, the analysis results will be used to observe the dynamic behavior and numerical values of structure in vibration so as to find out the critical positions of weak point and maximum amplitude improve the robot design.