本研究以實驗方法探討高功率電子元件常用的五種鰭片散熱模組於自然對流及強制對流下的熱傳性能，實驗條件以實際電子元件的參數運作範圍做為基準，利用直流電源供應器與馬達風扇對測試段進行等熱通量加熱與強制氣流冷卻，模擬出電子元件實際運作範圍下的葛拉秀夫數及雷諾數，以了解其對散熱性能(紐塞爾數)的影響。實驗結果指出在自然對流熱傳狀態下，Model E (銅軸心徑向鰭片散熱模組)有最佳的散熱性能，而隨著單位面積加熱量的上昇，Model E、A、C 有較顯著的自然對流熱傳增益；而在強制對流熱傳狀態下，整體熱傳以Model A (圓形鰭柱散熱模組)為最佳，最後，本研究將實驗結果歸納出經驗公式，做為相關散熱設計的參考。

This study experimentally investigated the heat transfer characteristics of five common finned cooling modules used for high-power electronic devices under nature convection and forced convection conditions. The test criteria were based on the operating ranges of relevant parameters for the real electronic devices. By using the DC power supply and the motor fan to separately provide the iso-flux heating and forced fluid flow cooling to the test modules, one could get the Reynolds number and the Grashof number within the real operating range of the electronic device. Then, the effects of relevant parameters on heat transfer performance (i.e. Nusselt number) would be explored. The results indicate that the Model E test module, with axial copper cylinder and radial fins, dissipated the most amount of heat at nature convection condition. Model E, Model A and Model C got more remarkable nature convection heat transfer enhancement as increasing the heat flux per unit surface area. However, at forced convection condition, the total heat transfer performance of Model A test module with circular pin fins was the best. Finally, this work provided the empirical formulas according to the overall data, which can be referred by the related cooling design.