本研究之研究架構是依據ISO/TS 14067標準與環保署所編指引，探討晶圓測試進行碳足跡評估之必要原則與方法，並獲致碳足跡評估結果。本研究挑選一家實際的專業晶圓測試廠為個案，並選擇測試量占最多數的晶圓型號進行晶圓測試碳足跡分析，產品功能單位為一批25片晶圓。研究結果顯示晶圓測試每功能單位之碳足跡為759.83公斤CO₂e/批，其中，外購電力之溫室氣體排放量為758.23公斤CO₂e/批，占總排放量之99.79%，因此外購電力是晶圓測試碳足跡最主要溫室氣體排放來源。

This study proposes a research structure. The standards of ISO/TS 14067 and carbon footprint (CFP) guide of Environmental Protection Administration are used to investigate the required principles and methods to assess CFP of wafer probing. Based on the relevant standards, the CFP of wafer probing is gained. A real wafer probing factory is used as a case study and the wafer type with the majority of probing demand is chosen to assess the CFP of wafer probing. The functional unit is 25 wafers per lot. Based on the results of the case study, the CFP of wafer probing is 759.83Kg CO₂e per lot. Among them, the greenhouse gases (GHG) emission of purchased electricity is 758.23Kg CO₂e, i.e., 99.79% of total GHG emission. Therefore, purchased electricity is the major GHG emitter of the CFP of wafer probing.