熱壓印快速模具於熱壓印過程中，背襯模板凹槽與澆道交接處因為應力集中，進而造成熱壓印快速模具於短時間內即產生失效。為了解決此問題，本研究於背襯模板凹槽與澆道交接處進行倒角，並運用ANSYS電腦輔助工程分析軟體，分析不同倒角之最大應力值。研究結果發現，當倒角為8 mm時，交接處之最大應力值從原始之6.36 MPa降低至3.63 MPa，最大應力值減少約43%；實際製作熱壓印快速模具，並經過熱壓印來驗證模具壽命，結果發現於背襯模板凹槽與澆道交接處進行倒角5 mm之熱壓印快速模具，其模具壽命約為傳統熱壓印快速模具之2.2倍。

The junction of the groove and sprue of the backing plate has serious local stress concentration, leading to the reduction of lifespan of precision hot embossing rapid tooling during hot embossing molding. In this study, the junction of the groove and sprue of the backing plate was machined with chamfer to reduce local stress concentration for enhancing the lifespan of precision epoxy resin mold. The ANSYS simulation results revealed that the maximum stress reduced from 6.36 MPa to 3.63 MPa when the chamfer is 8 mm, leading to the reduction of local stress concentration of about 43%. Micro-hot embossing verification test showed that the lifespan of hot embossing rapid tooling with the chamfer of 5 mm is about 2.2 times that of the epoxy resin mold without the chamfer.