隨著5G第五代行動通訊產品使用的普及化，加上5G第五代行動通訊低延遲高頻寬與高可靠度的特性，人們對5G第五代行動通訊系統產品的使用需求日益增加，尤其是在COVID-19新冠肺炎大流行期間的在家上班與智慧醫療，IoT物聯網，工業4.0智慧製造與VoT-V2V車聯網應用更多，因而5G第五代行動通訊晶片的可靠度要求也相對提高，所以本文針對開發階段與試量產階段5G第五代行動通訊晶片樣本，進行可靠度預估與加速壽命試驗，將兩者結果進行比對以驗證預估值的合理性，並藉助振動試驗及零件表面熱分佈試驗進行失效模式分析，進而了解5G第五代行動通訊晶片的可靠度指標平均失效時間(Mean Time To Failure, MTTF)與產品失效模式，且進一步分析5G第五代行動通訊晶片失效可能發生的原因，以供研發人員作為系統設計改善與零組件選用上的參考，以增強高5G第五代行動通訊晶片與產品的可靠度，提供大眾更完美的行動通訊服務品質。

The 5G (5th generation mobile networks or 5th generation wireless systems) has become very popular all over the world in recent years. We believe that the 5G chipset is a key component of SOHO & AI smart medical technology for COVID-19, IE4.0 smart manufacture, car driving & navigation. Moreover, the 5G chipset is widely used in IoT, industrial or mobile VoT, V2V 5G system. Therefore, very high reliability is needed for 5G chipset. This is a field case study of reliability for the mean time to failure (MTTF) of the 5G chipset. We obtain the failure mode information and mean time to failure (MTTF) value via the accelerated life test result and thermal profiles test results of the 5G chipset in prototype stage. And test results can be utilized as an important reference for engineers to improve the design and component selection of 5G chipset.