根據每年歐洲太陽能協會 (EPIA) 預測太陽能市場技術分析，矽晶太陽能電池技術由於具有高度成熟的技術以及元件穩定性，短期內仍是市場主流，然而為了達到低成本／高輸出的要求，必須藉由材料的匹配最佳化以及結構的改良，以達到高效能的目標。背接觸式太陽能電池模組不同於傳統的太陽能電模組，除了電池設計突破傳統電池遮光面積過大的問題，模組技術方面，可改善封裝損失與降低串聯電阻，另一方面，以導電膠取代傳統的高溫焊接製程，能大幅降低晶片翹曲率，並且達到快速封裝製程的目標。

According to the annual reports and analyses from European Photovoltaic Industry Association (EPIA), crystalline solar (c-Si) cell module technology should be the main stream on the photovoltaic market share by 2030 since the c-Si has a high reliability nature. However, in order to fulfi ll the requirements on low-cost and high performance,back contact solar cell module technology was carried out to increase the light-exposure area on the cell surface and reduce the power loss/series resistance at module end. Compare to the conventional H-grid solar module process,the high temperature soldering was replaced by electrical conductive adhesive for interconnecting process. Thus, the wafer bowing rate can be reduced and a fast lamination step can be achieved.