本研究以 XYθ 三軸精密進給系統為架構，搭配儀控平台電控技術、整機系統整合技術、影像對位與光罩 對準技術，並結合 PC-based 控制器發展多軸人機界面、多軸精度量測與補償技術等，開發一套「具光罩 對準之高剛性 XYθ 三軸雷射直寫影像進給系統」。此對位平台具有高剛性、高承載能力、高對位速度、 高精密度和高定位重現性等優點，可應用於印刷電路板 (PCB)、晶圓、觸控面板、積體電路 (IC)、發光二 極體 (LED) 和被動元件等產業之對位、加工和檢測之先進曝光製程設備。此外，本研究於機構設計最大 特點為 X 和 Y 軸共平面，並且於 θ 軸採用圓弧導軌增強其承載能力，藉此提高產品對位和定位之精準度 和效率，同時提昇國內自動化設備開發技術能力與國際競爭力。未來此技術亦可擴大應用於 LED 之陶瓷 基板鑽孔和切割、晶圓檢測、印刷電路板之鑽孔、薄膜太陽能電池製程之雷射邊緣隔離和藍寶石基板劃線 或表面處理等對位製程。

An XYC-axis precision feeding system was established into a novel high-speed and controllable position platform with a precision XYθ stage that combined with motion control, system integrated engineer, image alignment, and mask aligning techniques for laser direct imaging (LDI) processes. The developed system linked a PC-based controller, multi-axis measurement and error compensation techniques reached a high stiffness, high loading capability, high speed alignment, high precision, and high positioning repeatability. This system could be used in the alignment, fabrication, and inspection equipments for the advanced lithography industries such as printed circuit boards (PCBs), wafers, touch panels, integrated circuits (ICs), light emitting diodes (LEDs), and spare parts. In addition, the primary aims of this project were to design a mechanism with X and Y axes in a coplanarity and to adopt circular arc guideways in a C axis to improve the loading capability when moving the XYC axes simultaneously. The proposed system promotes the accuracy and efficiency of the alignment and position and the international competition ability for automation equipments. In the future, the controllable position platform will widely be installed in the advanced equipments for drilling and cutting of LED ceramic substrates, inspection of wafers, drilling of PCB substrates, laser edge isolation of thin-film solar cells, scribing or surface texturing of sapphires, and other tasks.