三維晶片(Three-Dimensional Integrated Circuit; 3-D IC)是在垂直方向堆疊不同功能的晶片之技術，是一種跳躍式的技術發展。為使晶片能夠正確堆疊，從IC設計、晶圓製造到IC的封裝與測試都比以往要更嚴謹規範。三維晶片亦提供了異質晶片堆疊的發展空間，擴大了異業合作的機會，例如原先涇渭分明的晶圓代工產業與DRAM產業就有機會在3-D IC產品上互相合作。台灣的晶圓代工、IC封裝與IC測試佔有率為全球第一，DRAM製造與IC設計業也居全球重要地位，若整合這些資源發展3-D IC技術，預期可以帶動創新產品發展並激發台灣半導體產業的下一波機會。

Three-Dimensional Integrated Circuit (3-D IC) technology is to vertically stack dies and is expected to produce big progress in semiconductor industry. To have correct die stacking, 3-D IC technology must be strictly re-defined, including design flow, manufacturing, test and package. With 3-D IC technology, we can also stack dies which are fabricated in different technologies, thus providing a feasible way toward heterogeneous integration. Heterogeneous integration helps the cooperation of various companies, such as foundry and DRAM companies, and enhances their own competitive advantages. Currently, Taiwan's companies have over 50% global market share in foundry and OSAT business. Taiwan's DRAM companies and fabless houses are also indispensable in the global market. If 3-D IC technology can bring them together, we expect that it will make a huge progress in Taiwan's semiconductor industry in the next decade.