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電腦與通訊

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篇名 下世代行動通訊平台:PAC Duo+
卷期 138
並列篇名 Next Generation Mobile Communication Platform: PAC Duo+
作者 丁滎隍范佐毅紀坤明
頁次 053-058
關鍵字 行動通訊系統單晶片PACMobile CommunicationSystem-on-Chip;SoCParallel Architecture Core;PAC
出刊日期 201104

中文摘要

本文以新一代手持式行動通訊平台PAC Duo+為主體, 描述PAC Duo+與前一代平台PAC Duo在硬體架構與設計流程上的差異, 並展示PAC Duo+結合WiMAX與Android成為PAC Duo PID+的實際成品。文中描述了PAC Duo+平台中的五個重要IP(EMDMA、Deblocking Filter、Entropy Decoder、PMU、YUV2RGB)的特徵, 以及設計流程中引進的ESL(Electronic System Level)與HLS(High-Level Synthesis)設計方式。

英文摘要

This paper shows the features of new generation hand-held mobile communication platform PAC Duo+,and the demo of PAC Duo PID+, which consists of PAC Duo+, WiMAX, and powerful mobile operating system
Android. The content also includes the difference between PAC Duo+ and its predecessor, PAC Duo. It will show the features of five important IP (EMDMA, Deblocking Filter, Entropy Decoder, PMU, and YUV2RGB),and the newly introduced design flow ESL (Electronic System Level) and HLS (High-Level Synthesis).

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