結合微感測功能之3C電子應用已成為未來產品趨勢，為了達到低成本及縮小化目的，發展可應用於微感測系統之互補式金氧半微機電(CMOS MEMS)平台技術，將有助於應用系統整合開發。為使相關平台技術可有效應用於電路系統設計開發，須提供包含參考準則、製程描述檔、材料參數與微機電系統參考設計等資訊，本文將搭配相關設計範例完整地描述設計流程。

To integrate the sensor function is the future trend of 3C products. The CMOS MEMS technology platform is convenient to be adopted for the integration of micro-sensing system. The design kits including the design rule file, process description file, material parameters, and reference design are important to make a powerful platform for the implementation of heterogeneous circuit and system.