不同於傳統的靜態溫度管理或是動態散熱途徑，本研究提出一個可應用在三維晶片的晶片型金屬散熱晶格(Metallic Thermal Skeletons)架構設計，其目的是要經由此設計，傳導由虛擬核心所產生的熱，並且可以分析解構晶片內部的發熱現象。藉由本文提出的設計，將可大幅降低熱點的最大溫度，同時亦可改善測試晶片熱均勻度，除此之外，本研究所提出的晶片型金屬散熱晶格是利用後段製程(Back-end-of-line; BEOL)金屬導線交互連結後而形成的晶片型散熱器，周圍包含有溫度感測器的陣列也實現於此測試晶片中，主要是為了可以在晶片上直接感測周圍的溫度，這些溫度感測器陣列主要是利用環式震盪器(Ring Oscillator)之震盪頻率會受溫度影響的原理，進一步設計而成。同時，本文也試圖利用模擬與理論運算，對於所提出的晶片型金屬散熱晶格更進一步的分析。最後，再利用紅外線熱像分析法對於本文所提出的熱傳測試晶片進行實體監測，並且同步分析虛擬多核心以及其在晶片型金屬散熱晶格效用下所產生的溫度，實驗數據顯示，吾人所提出的設計確實可以有效增進熱傳導的效能。

Different from traditional static thermal solution (STS) or dynamic thermal management (DTM), we propose a design of metallic thermal skeletons which can be applied in three-dimensional integrate circuit in order to conduct the heat generated by the virtual core. Not only the proposed design can lower the maximum temperature of the hotspot, but improve the thermal uniformity of the test chip. Furthermore, we present metallic thermal skeletons, which are composed of the BEOL metallization for connection with the on-chip heat sink. Virtual cores with temperature sensors are also designed to construct a multi-core array and, as the role of the virtual many-core system. The thermal sensor network is based on a ring oscillator whose oscillation frequency is sensitive to temperature. Simulations and theoretical computations have been performed to see the effectiveness of the proposed metallic thermal skeletons. Finally, the infrared radiation thermal images are employed for monitoring the temperature of the virtual cores and that of the metallic thermal skeletons. The experimental results show that one of proposed design provides excellent capability for enhancement of thermal conduction.